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07/30169763 DC : 0

Current
Current

The latest, up-to-date edition.

BS EN 62515 - EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA
Available format(s)

Hardcopy , PDF

Language(s)

English

BS EN 62515

Committee
EPL/501
DocumentType
Draft
Pages
31
PublisherName
British Standards Institution
Status
Current

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
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IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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