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09/30186180 DC : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING

Available format(s)

Hardcopy , PDF

Superseded date

30-06-2010

Language(s)

English

1 Scope and purpose
2 Normative references
3 Terms and definitions
4 Requirements to component design and component
   specifications
5 Specification of assembly process conditions
6 Typical process conditions
7 Requirements for components and component specifications
   for THR soldering processes

BS EN 61760-3 ED.1

Committee
EPL/501
DocumentType
Draft
Pages
19
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

IEC 60068-2-82:2007 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 62090:2017 Product package labels for electronic components using bar code and two-dimensional symbologies
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60286-5:2003+AMD1:2009 CSV Packaging of components for automatic handling - Part 5: Matrixtrays
IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
ISO 8601:2004 Data elements and interchange formats Information interchange Representation of dates and times
IEC 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60062:2016 Marking codes for resistors and capacitors
IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms

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$39.22
Including GST where applicable

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