BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR

Available format(s)

Hardcopy , PDF

Language(s)

English

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Terms, definitions and symbols
4 The signs
5 Essential elements and feature
6 Measurement methods
7 Test methods of the reliability

BS EN 60747-14-6 ED 1.0.

Committee	EPL/47
DocumentType	Draft
Pages	34
PublisherName	British Standards Institution
Status	NA

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-17:2003	Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
IEC 60749-8:2002	Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-21:2011	Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-25:2003	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-30:2005+AMD1:2011 CSV	Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-4:2017	Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC 60749-31:2002	Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
IEC 60749-1:2002	Semiconductor devices - Mechanical and climatic test methods - Part 1: General
IEC 60749-29:2011	Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
IEC 60749-11:2002	Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
IEC 60749-36:2003	Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
IEC 60749-18:2002	Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
IEC 60749-27:2006+AMD1:2012 CSV	Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 60749-16:2003	Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
IEC 60749-9:2017	Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
IEC 60749-33:2004	Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
IEC 60749-24:2004	Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
IEC 60721-2-1:2013	Classification of environmental conditions - Part 2-1: Environmental conditions appearing in nature - Temperature and humidity
IEC 60747-14-1:2010	Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
IEC 60749-15:2010	Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60749-26:2013	Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60721-3-0:1984+AMD1:1987 CSV	Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Introduction
IEC 60749-35:2006	Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
IEC 60749-7:2011	Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
IEC 60747-1:2006+AMD1:2010 CSV	Semiconductor devices - Part 1: General
IEC 60749-13:2002	Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
IEC 60749-34:2010	Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-6:2017	Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-2:2002	Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
ISO/IEC Guide 2:2004	Standardization and related activities General vocabulary
IEC 60749-3:2017	Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60068-2-1:2007	Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60749-10:2002	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-32:2002+AMD1:2010 CSV	Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-14:2003	Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
IEC 60749-19:2003+AMD1:2010 CSV	Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
IEC 60749-22:2002	Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-12:2002	Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
IEC 60721-3-1:1997	Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage
IEC 60749-23:2004+AMD1:2011 CSV	Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life