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15/30310531 DC : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

BS EN 61709 ED 3.0 - ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION

Available format(s)

Hardcopy , PDF

Superseded date

31-07-2017

Language(s)

English

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Context and conditions
5 Generic reference conditions and stress models
6 Integrated semiconductor circuits
7 Discrete semiconductors
8 Optoelectronic components
9 Capacitors
10 Resistors and resistor networks
11 Inductors, transformers and coils
12 Microwave devices
13 Other passive components
14 Electrical connections
15 Connectors and sockets
16 Relays
17 Switches and push-buttons
18 Signal and pilot lamps
19 Printed circuit boards (PCB)
20 Hybrid circuits
Annex A (Normative) - Failure modes of components
Annex B (Informative) - Thermal model for semiconductors
Annex C (Informative) - Failure rate prediction
Annex D (informative) - Considerations on mission profile
Annex E (informative) - Useful life models
Annex F (informative) - Physics of failure
Annex G (informative) - Considerations for the design of
        a data base on failure rates
Annex H (informative) - Potential sources of failure rate
        data and methods of selection
Annex I (informative) - Overview of component classification
Annex J (informative) - Presentation of component reliability
        data
Annex K (informative) - Examples
Bibliography
Literature

BS EN 61709 Ed 3.0.

Committee
DS/1
DocumentType
Draft
Pages
109
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

IEC 62308:2006 Equipment reliability - Reliability assessment methods
IEC 61812-1:2011 Time relays for industrial and residential use - Part 1: Requirements and tests
IEC 61649:2008 Weibull analysis
IEC 61014:2003 Programmes for reliability growth
IEC 60050-151:2001 International Electrotechnical Vocabulary (IEV) - Part 151: Electrical and magnetic devices
IEC 61360-4:2005 Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes
VITA 51.2 : 2016 PHYSICS OF FAILURE RELIABILITY PREDICTIONS
ISO 10303-31:1994 Industrial automation systems and integration Product data representation and exchange Part 31: Conformance testing methodology and framework: General concepts
ISO 10303-11:2004 Industrial automation systems and integration Product data representation and exchange Part 11: Description methods: The EXPRESS language reference manual
IEC 61810-2:2017 Electromechanical elementary relays - Part 2: Reliability
IEC 61163-2:1998 Reliability stress screening - Part 2: Electronic components
DEFSTAN 00-42(PT3)/4(2011) : 2011 RELIABILITY AND MAINTAINABILITY ASSURANCE GUIDE - PART 3: R&M CASE
IEC 60300-3-2:2004 Dependability management - Part 3-2: Application guide - Collection of dependability data from the field
IEC 61810-2-1:2017 Electromechanical elementary relays - Part 2-1: Reliability - Procedure for the verification of B<sub>10</sub> values
IEC 61703:2016 Mathematical expressions for reliability, availability, maintainability and maintenance support terms
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
MIL-C-18312 Revision G:2013 CAPACITOR, FIXED, METALLIZED (PAPER-PLASTIC, OR PLASTIC FILM) DIELECTRIC, DIRECT CURRENT (HERMETICALLY SEALED IN METAL CASES), GENERAL SPECIFICATION FOR
IEC 60050-521:2002 International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
IEC 60300-3-5:2001 Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles

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