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Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

BS EN 60664-3 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
Available format(s)

Hardcopy , PDF

Superseded date

31-10-2017

Language(s)

English

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and Definitions
4 Design requirements
5 Tests
Annex A - Test sequences
Annex B (normative) - Technical committees' decisions
Annex C (normative) - Printed wiring board for testing coatings

BS EN 60664-3.

Committee
GEL/109
DocumentType
Draft
Pages
25
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

IEC 60454-3-1:1998+AMD1:2001 CSV Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC GUIDE 104:2010 The preparation of safety publications and the use of basic safety publications and group safety publications
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 60664-1:2007 Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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