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16/30338642 DC : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

BS EN 62739-3 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHOD

Available format(s)

Hardcopy , PDF

Superseded date

30-04-2017

Language(s)

English

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Procedure of selecting applicable erosion test method
6 Common items for each test method
7 Overview of the test methods
Annex A (informative) - Guidance for selection of test
        temperature, test duration and bending stress
Annex B (informative) - Guidance for the maximum
        depth and other measurement
Annex C (informative) - Erosion mechanism
Annex D (informative) - Thermal acceleration for erosion
Bibliography

BS EN 62739-3.

Committee
EPL/501
DocumentType
Draft
Pages
30
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
ISO 16143-3:2014 Stainless steels for general purposes Part 3: Wire
ISO 16143-2:2014 Stainless steels for general purposes Part 2: Corrosion-resistant semi-finished products, bars, rods and sections
ISO 16143-1:2014 Stainless steels for general purposes Part 1: Corrosion-resistant flat products
IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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