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AS
AS 60068.2.58-2004

AS 60068.2.58-2004

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Environmental testing Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

30-01-2019

Language(s)

English

Published date

01-01-2004

Publisher

Standards Australia

Preview

1 Scope2 Normative references3 Terms and definitions4 Preconditioning5 Solder bath method 5.1 Test apparatus and materials for the solder bath method6 Procedure 6.1 Number of specimens 6.2 Clamping 6.3 Fluxing 6.4 Solder immersion7 Solder reflow methods 7.1 Test apparatus and materials8 Test procedure 8.1 Number of specimens 8.2 Application of solder paste 8.3 Placement of specimens 8.4 Preheating 8.5 Solder reflow9 Flux removal 9.1 Recovery 9.2 Evaluation10 Information to be given in the relevant specificationAnnex A (normative) - Criteria for visual examinationAnnex B (informative) - Guidance

The AS 60068 Standards include a series of environmental testing procedures, information on the severity of tests, and information on atmospheric conditions for measurement and testing. Although primarily intended for electrotechnical products, many of the procedures are equally applicable to other industrial products

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). Soldering tests applicable to SMD in IEC 60068-2-69 and to other electrotechnical products are in IEC 60068-2-20 and IEC 60068-2-54, for which guidance is given in IEC 60068-2-44. This standard provides standard procedures for determining the solderabillty, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD) (hereinafter referred to as specimens). The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems.

Committee
EL-026
DocumentType
Standard
ISBN
0 7337 6220 4
Pages
13
ProductNote
Withdrawn 30-01-2019.
PublisherName
Standards Australia
Status
Withdrawn
Supersedes

Standards Relationship
IEC 60068-2-58:1999 Identical

First published as AS 60068.2.58-2004.

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Hardcopy - English
PDF 1 User - English
PDF 3 Users - English
PDF 5 Users - English
PDF 9 Users - English
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