AWS SHB : 3

Personnel
Preface
List of Tables
List of Figures
1 Fundamentals of Soldering Technology
      1.1 Introduction
      1.2 Physical Metallurgy
             1.2.1 Metals and Alloys
                      1.2.1.1 Phase Diagrams
                      1.2.1.2 Structures and Properties
                      1.2.1.3 Solder Joint Formation and
                                 Microstructure
      1.3 Solder Joint Design for Product Manufacturability
             and Service Reliability
             1.3.1 Product Manufacturability
             1.3.2 Product Reliability
                      1.3.2.1 Static Loads
                      1.3.2.2 Fatigue Loads
                      1.3.2.3 Corrosion
      1.4 Solder Alloy Physical Properties: Measurement
             Techniques
             1.4.1 Density
             1.4.2 Electrical Properties
             1.4.3 Thermal Properties
                      1.4.3.1 Thermal Properties - DSC
                                 Analysis
                      1.4.3.2 Thermal Properties - DTA
                                 Analysis
             1.4.4 Fluid and Solderability Properties
                      1.4.4.1 Fluid Properties
                      1.4.4.2 Wetting/Spreading and
                                 Solderability Properties
      1.5 Solder Alloy and Solder Joint Mechanical
             Properties - Measurement Techniques
             1.5.1 Bulk Solder Mechanical Properties
                      Measurements
             1.5.2 Solder Joint Mechanical Properties
                      Measurements
2 Solder Materials
      2.1 Introduction
      2.2 Contamination
      2.3 Specifications
      2.4 Bulk and Joint Properties of Solder Alloys
             2.4.1 Tin, Tin-Lead, Tin-Lead-Antimony, Tin-
                      Lead-Silver, and Lead-Silver Solders
             2.4.2 Tin-Antimony, Tin-Antimony-Silver
                      (Copper), and Tin-Silver Alloys
             2.4.3 Tin-Zinc, Zinc-Aluminium, and Other
                      Zinc-Containing Solders
             2.4.4 Indium, Indium-Tin, Indium-Lead, and
                      Other Indium-Containing Solders
             2.4.5 Bismuth-Containing ('Fusible') Solders
             2.4.6 Au-Based Solder Alloys
             2.4.7 Cd-Containing Solder Alloys
3 Substrate Materials
      3.1 Introduction
      3.2 Coatings
      3.3 Metallic Substrate Materials
             3.3.1 Noble Metals and Alloys
                      3.3.1.1 Alloy Descriptions
                      3.3.1.2 Solder Alloys
                      3.3.1.3 Cleaning Processes and Fluxes
             3.3.2 Copper and Cu-Based Alloys
                      3.3.2.1 Alloy Descriptions
                      3.3.2.2 Solder Alloys
                      3.3.2.3 Cleaning Processes and Fluxes
             3.3.3 Steels
                      3.3.3.1 Alloy Descriptions
                      3.3.3.2 Solder Alloys
                      3.3.3.3 Cleaning Processes and Fluxes
             3.3.4 Stainless Steels and High-Alloy Fe-Based
                      Materials
                      3.3.4.1 Alloy Descriptions
                      3.3.4.2 Solder Alloys
                      3.3.4.3 Cleaning Processes and Fluxes
             3.3.5 Nickel and Nickel-Based Alloys
                      3.3.5.1 Alloy Descriptions
                      3.3.5.2 Solder Alloys
                      3.3.5.3 Cleaning Processes and Fluxes
             3.3.6 Lead
                      3.3.6.1 Alloy Descriptions
                      3.3.6.2 Solder Alloys
                      3.3.6.3 Cleaning Processes and Fluxes
             3.3.7 Aluminium and A1 Alloys
                      3.3.7.1 Alloy Descriptions
                      3.3.7.2 Solder Alloys
                      3.3.7.3 Cleaning Processes and Fluxes
             3.3.8 Magnesium and Mg Alloys
                      3.3.8.1 Alloy Descriptions
                      3.3.8.2 Solder Alloys
                      3.3.8.3 Cleaning Processes and Fluxes
             3.3.9 Tin and Sn Alloys
                      3.3.9.1 Alloy Descriptions
                      3.3.9.2 Solder Alloys
                      3.3.9.3 Cleaning Processes and Fluxes
             3.3.10 Zinc and Zn Alloys
                      3.3.10.1 Alloy Descriptions
                      3.3.10.2 Solder Alloys
                      3.3.10.3 Cleaning Processes and Fluxes
             3.3.11 Refractory Metals and Alloys
                      3.3.11.1 Alloy Descriptions
                      3.3.11.2 Solder Alloys
                      3.3.11.3 Cleaning Processes and Fluxes
             3.3.12 Special Materials - Electrical Contact
                      Materials
                      3.3.12.1 Alloy Descriptions
                      3.3.12.2 Solder Alloys
                      3.3.12.3 Cleaning Processes and Fluxes
      3.4 Nonmetallic Materials
             3.4.1 Ceramics and Glasses
                      3.4.1.1 Material Description
             3.4.2 Solder Alloys
             3.4.3 Cleaning Processes and Fluxes
4 Fluxes
      4.1 Introduction
             4.1.1 Fundamental Concepts
             4.1.2 How to Use a Flux
             4.1.3 Flux Types
                      4.1.3.1 Rosin-Based Fluxes
                      4.1.3.2 Organic Acid Fluxes
                      4.1.3.3 Inorganic Acid Fluxes
                      4.1.3.4 Reaction Fluxes
                      4.1.3.5 Atmospheres
5 Solder Pastes
6 Assembly Processes
      6.1 Introduction
      6.2 Incoming Material Storage and Handling
      6.3 Preassembly Preparation (Precleaning) Processes
      6.4 Soldering Processes
             6.4.1 Introduction
                      6.4.1.1 A 'Global' Perspective
                      6.4.1.2 Process Development Logistics
             6.4.2 Hand Soldering
                      6.4.2.1 Soldering Iron
                      6.4.2.2 Soldering with a Torch
                                 (Flame)
                      6.4.2.3 Process Development - General
                                 Remarks
             6.4.3 Semiautomated and Automated Soldering
                      6.4.3.1 Variations on Torch Soldering
                                 (Robotic Automation)
                      6.4.3.2 Furnace Soldering
                      6.4.3.3 Vapor Phase Soldering
                      6.4.3.4 Immersion (Dip) Soldering
                      6.4.3.5 Induction Soldering
                      6.4.3.6 Resistance Soldering
                      6.4.3.7 Laser Beam Soldering
                      6.4.3.8 Hot Gas Soldering
                      6.4.3.9 Ultrasonic Soldering
      6.5 Postassembly Cleaning Techniques
             6.5.1 Solder Assembly Residues
             6.5.2 Cleaning Techniques
             6.5.3 Verification Techniques
      6.6 Storage Considerations
7 Inspection Techniques for Product Acceptance and
      Process Optimization
      7.1 Introduction
      7.2 Defects
      7.3 Quantitative Defect Analysis
      7.4 Defect Detection
             7.4.1 Nondestructive Techniques
                      7.4.1.1 Visual Inspection and
                                 Microscopy
                      7.4.1.2 X-ray Radiography/
                                 Laminography
                      7.4.1.3 Ultrasonic Inspection
                      7.4.1.4 Infrared (or Dynamic Thermal)
                                 Imaging
                      7.4.1.5 Pressure and Vacuum Leak
                                 Testing
                      7.4.1.6 Proof Testing
                      7.4.1.7 Liquid Dye or Fluorescent Dye
                                 Penetrant
             7.4.2 Destructive Techniques
                      7.4.2.1 Metallographic Cross-
                                 Sectioning
                      7.4.2.2 Mechanical Testing
      7.5 Rework and Repair
8 Environmental, Safety, and Health
      8.1 Introduction
      8.2 Base Metals
      8.3 Fluxes
      8.4 Solders
      8.5 Soldering Processes
      8.6 Cleaning Processes
Annex A - Solution of the Thermal Expansion Mismatch Equations
          for a Two-Base Material System (Single Joint) Having
          Isotropic Materials and Temperature-Independent
          Material Properties
Annex B - Metallographic Sample Preparation for Soft Solder
          Joint Specimens
      B.1 - Grinding and Polishing Procedure
      B.2 - Etchant for Intermetallic Compound Layer Accent -
            Cu Substrate
Annex C - Microstructures of Commonly Used Solder Alloys
Annex D - Use of Thermocouples to Monitor Part Temperatures
Annex E - References
Index