Method for measuring resistance when subjected to a constant peeling force at a controlled elevated temperature over a timed interval.

This Section of BS 5131 describes a laboratory test method for measuring the heat resistance of a bonded joint.

The main purpose of the method is to compare adhesives and as a consequence recommendations are given as to appropriate adherends. The most common application is the comparison of sole-attaching adhesives, but other types of adhesives may also be compared using this method. In addition, the method may be used for testing any other combination of materials in a bonded assembly, provided that at least one of the adherends is flexible. Joints prepared by the direct bonding of hot melt adhesives are outside the scope of this method, since these joints would require a much higher temperature than that given in the method to soften the adhesive.

NOTE 1 Adequate heat resistance is especially important for sole-attaching adhesives, otherwise the sole bond may fail when footwear is displayed in shop windows, or when exported to warmer climates, or if exposed to high temperatures during wear. The temperatures involved in the test are believed to represent the maximum temperatures likely to be encountered by footwear in normal use. The method can thus be applied to any adhesive to check suitability for use but would not normally be applied to high melting point adhesives such as hot melt lasting adhesives which are used in direct bonding at higher temperatures.

NOTE 2 The titles of the publications referred to in this standard are listed on the inside back cover.