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  • BS 9760(1977) : 1977

    Cancelled Standard has been cancelled.
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    SPECIFICATION FOR PRINTED CIRCUITS OF ASSESSED QUALITY:GENERIC DATA AND METHODS OF TEST:CAPABILITY APPROVAL PROCEDURE AND RULES

    Available format(s):  Hardcopy, PDF

    Cancelled date:  15-12-2000

    Language(s):  English

    Published date:  01-01-1977

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Cooperating organizations
    Specification
    Section one. Principles and mandatory procedures
    1.1 General matters
    1.1.1 Scope
    1.1.2 Related specifications and documents
    1.1.3 Terminology
    1.1.4 Letter symbols, signs and abbreviations
    1.1.5 Graphical symbols
    1.1.6 Marking of the board and package
    1.1.7 Eligibility for capability approval
    1.1.8 Structurally similar components and common
               production processes
    1.1.9 Delayed delivery
    1.1.10 Supplementary procedure for qualification
               approval
    1.1.11 Certified test records
    1.1.12 Standard rating and characteristics: climatic
               category
    1.1.13 Unchecked parameters
    1.1.14 Procedure to be followed in the event of
               failure of group C inspection
    1.1.15 Ordering information
    1.1.16 Reduced inspection
    1.2 Test procedures
    1.2.1 Test and measurement conditions
    1.2.1.1 General
    1.2.1.2 Measurement test patterns
    1.2.1.3 Production testing
    1.2.2 Visual inspection
    1.2.3 Dimensioning and gauging
    1.2.3.1 Board and pattern dimensions
    1.2.3.2 Thickness
    1.2.3.2.1 Thickness for single-sided and double-sided
               boards
    1.2.3.2.2 Thickness of multilayer boards
    1.2.3.2.3 Thickness in edge connector zone
    1.2.3.3 Conductor width
    1.2.3.4 Conductor spacing
    1.2.3.5 Edge connector defects
    1.2.3.6 Holes/registration
    1.2.3.7 Plating thickness
    1.2.4 Electrical test procedures
    1.2.4.1 Resistance of conductors
    1.2.4.2 Insulation resistance
    1.2.4.2.1 Insulation resistance of the surface
    1.2.4.2.2 Insulation resistance within a layer
    1.2.4.2.3 Insulation resistance between layers
    1.2.4.3 Interconnection continuity
    1.2.4.4 Internal short circuits
    1.2.5 Mechanical test procedures
    1.2.5.1 Strength of terminations
    1.2.5.1.1 Pull-off strength
    1.2.5.1.2 Pull-out strength of plated through holes
    1.2.5.2 Peel strength
    1.2.5.2.1 Peel strength of conductors on rigid boards
    1.2.5.2.2 Peel strength of conductors on a flexible
               base with or without cover layer
    1.2.5.2.3 Peel strength of conductors after immersion
               in specified solvents
    1.2.5.3 Flatness
    1.2.5.4 Adhesion of plating
    1.2.5.5 Flexural fatigue
    1.2.6 Environmental and miscellaneous test
               procedures
    1.2.6.1 Insulation resistance after damp heat
    1.2.6.2 Process contamination
    1.2.6.3 Rapid change of temperature
    1.2.6.4 Thermal shock
    1.2.6.4.1 Interlaminar bond of multilayer and flexible
               circuits
    1.2.6.4.2 Thermal shock on plated through holes
    1.2.6.4.3 Change in resistance of plated through holes
               (thermal cycling)
    1.2.6.5 Thermal endurance
    1.2.6.6 Solderability
    1.2.6.7 Porosity of platings
    1.2.6.8 Accelerated ageing
    1.2.6.9 Solvent resistance of solder resists and of
               markings
    1.2.6.10 Solder resistance of organic coatings such as
               solder resists and markings
    Section two. Capability approval and maintenance of
                    capability for printed circuits.
                    Requirements and procedures
    2.0 Introduction
    2.1 Capability assessment procedures
    2.2 Description of capability
    2.3 Demonstration of capability
    2.3.1 Test programme
    2.3.2 Standard capability
    2.3.3 Additional capability
    2.3.4 Base materials
    2.4 Abstract of description of capability
    2.5 Capability approval report
    2.6 Maintenance of approval
    2.7 Extension of approval
    2.7.1 Significant change procedure
    2.7.2 Amendment procedure to PD 9002 and the
               capability manual
    2.7.3 Temporary extension of approval
    2.7.4 Extension of approval to other types of
               printed circuits
    2.7.5 Additional customer requirement
    2.8 Review, suspension and withdrawal of
               capability approval
    2.8.1 Review approval
    2.8.2 Suspension of approval
    2.8.3 Withdrawal of approval
    Section three. Draft rules for preparation of a
                    customers's detail specification
    3.0 Introduction
    3.1 Related documents
    3.2 Customer's detail specification
    3.3 Instructions for completion of a customer's
               detail specification
    3.3.1 Marking
    3.3.2 Test information
    3.3.2.1 Optional tests
    3.3.2.2 Test requirements
    3.3.2.3 Inspection levels and AQLs
    3.4 Drawing information
    Section four. Rework
    4.0 Introduction
    4.1 General
    4.2 Rework capability approval procedure
    4.2.1 Capability manual
    4.2.2 Demonstration of capability
    4.2.3 Abstract for PD 9002
    4.3 Classification of rework
    4.4 Inspection of rework
    4.4.1 Capability approval
    4.4.2 Production quality conformance inspection
    Appendices
    A Fluidized sand bath apparatus
    B Customer's detail specification
    C Example of a certified test record
    D Guide to the requirements for the capability
               manual
    Tables
    1 Nominal thickness of tolerances
    2 Total thickness after plating
    3 Imperfections in zones of contact
    4 Classification of defects
    5 Rework capability approval inspection
    Figures
    1 Flow diagram for capability
    2 Edge connector zone
    3 Drum for peel test on flexible materials
    4 Flexural fatigue apparatus
    5 Schematic layout of steam/oxygen ageing test
               apparatus
    6 Change in resistance of plated through holes
               (thermal cycling)
    7 Typical circuit for measurement of resistance
               of plated through holes
    8 Abrasion fixture

    Abstract - (Show below) - (Hide below)

    Gives details of the essential test procedures and other general requirements and information relating to all forms of printed circuit. The limiting conditions under which rework is permitted and the procedures necessary for demonstrating the subsequent quality of reworked printed circuits are given.

    General Product Information - (Show below) - (Hide below)

    Committee ECL/19
    Document Type Standard
    Publisher British Standards Institution
    Status Cancelled

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS 6137(1982) : 1982 SPECIFICATION FOR ELECTROPLATED COATINGS OF TIN/LEAD ALLOYS
    BS 1872(1984) : 1984 SPECIFICATION FOR ELECTROPLATED COATINGS OF TIN
    BS 3597(1984) : 1984 SPECIFICATION FOR ELECTROPLATED COATINGS OF 65/35 TIN/NICKEL ALLOY
    BS 9526 N0001(1978) : 1978 DETAIL SPECIFICATION FOR MULTI-CONTACT EDGE SOCKET ELECTRICAL CONNECTORS - SINGLE OR DOUBLE SIDED, CLOSED ENDED, REPLACEABLE CONTACTS, THROUGH-BOARD SOLDER OR WIRE WRAP TERMINATIONS - FULL ASSESSMENT LEVEL

    Standards Referencing This Book - (Show below) - (Hide below)

    BS 1133-14(1985) : 1985 PACKAGING CODE - ADHESIVE CLOSING AND SEALING TAPES
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    BS 9761(1988) : 1988 SECTIONAL SPECIFICATION FOR CAPABILITY APPROVAL OF MANUFACTURERS OF MULTILAYER RIGID PRINTED WIRING BOARDS OF ASSESSED QUALITY WITH PLATED THROUGH HOLES
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