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BS CECC 00802:1994

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Harmonized system of quality assessment for electronic components. Guidance document: CECC Standard method for the specification of surface mounting components (SMDs) of assessed quality
Available format(s)

Hardcopy , PDF

Withdrawn date

04-11-2009

Language(s)

English

Published date

15-11-1994

Foreword
Preface
1. Introduction
2. Scope
3. Terminology
4. General requirements
4.1 Content of Specification
4.2 Declaration of process suitability
4.3 Packaging and packaging marking
4.4 Component marking
4.5 Storage
4.6 Component outline
4.7 Mechanical stress
4.8 Ordering information
5. Identification of assembly process conditions
5.1 General
5.2 Placement
5.3 Securing the component on substrate prior to
     soldering
5.4 Soldering methods
5.5 Cleaning
5.6 Removal and/or replacement of SMDs
5.7 Special handling conditions
6. Reference conditions
6.1 Process Limits
6.2 Classification
6.3 Reference set of assembly cleaning conditions
7. Tests
7.1 General
7.2 Soldering
7.3 Resistance to mechanical forces
7.4 Resistance to cleaning solvent
Annex A: Test methods for soldering
Annex B: Shear test and substrate bending test

Applies to all electronic components covered by the CECC System where these components are required to be assessed with respect to their application to surface mounting.

Committee
W/-
DevelopmentNote
Supersedes BS CECC 00802(1991) and 92/31292 DC. (01/2006)
DocumentType
Standard
Pages
28
PublisherName
British Standards Institution
Status
Withdrawn
Supersedes

Standards Relationship
CECC 00802 : 1994 Identical

BS EN 100015-1:1992 Basic specification. Protection of electrostatic sensitive devices Harmonized system of quality assessment for electronic components. Basic specification: protection of electrostatic sensitive devices. General requirements
BS 2011-2.1Td:1990 Environmental testing. Tests Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
BS 9000-2(1996) : 1996 GENERAL REQUIREMENTS FOR A SYSTEM FOR ELECTRONIC COMPONENTS OF ASSESSED QUALITY - SPECIFICATION FOR THE NATIONAL IMPLEMENTATION OF THE CECC SYSTEM
BS 2011-2.1XA(1981) : 1981 AMD 7553 ENVIRONMENTAL TESTING - TESTS - TEST XA AND GUIDANCE - IMMERSION IN CLEANING SOLVENTS
BS CECC 00111-0:1994 Rule of Procedure 11. Specifications An introduction to the types of specifications applicable within the CECC system
BS 4584-102.5(1990) : 1990 METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
BS 3934-6:1992 Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages
BS 2011-2.1T:1981 Environmental testing. Tests Test T. Soldering

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