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BS CECC 123400-003:1994

Current
Current

The latest, up-to-date edition.

Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-02-1994

Committees responsible
Foreword
Specification
1 General
2 Capability qualifying component (CQC)
3 Capability approval
4 Capability test programme
5 Traceability
Appendices
A Untitled
B Untitled
C Untitled
D Untitled
E Edge connector imperfections
F Adhesion of plating: tape method
G Porosity of platings - method of test
H Solvent resistance of organic coatings
J Solder resistance of organic coatings
Tables
I Capability approval test schedule
IIa Additional metallic conductor finishes
IIb Additional contact finishes
III Permanent organic finishes
IV Bonded stiffeners and rigidizers
Figures
1a Composite test pattern for flexible printed boards
     without through connections
1b Detailed dimensions of specimens shown in figure 1a
2 Test pattern for marking inks
3 Test pattern for solder mask or coverlayer
4a Assembly of test pattern rigidizers or stiffeners
4b Component parts of test pattern for rigidizers or
     stiffeners

Relates to single and double-sided flexible printed boards.

Committee
EPL/501
DevelopmentNote
Supersedes 93/206142 DC. (01/2006)
DocumentType
Standard
Pages
36
PublisherName
British Standards Institution
Status
Current
Supersedes

BS EN ISO 3543:2001 Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method
BS EN 123400:1992 Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
BS 6221-2:1991 Printed wiring boards Methods of test
BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: printed boards
ISO 3542:1975 Withdrawal of ISO 3542-1975
BS EN ISO 1463:2004 Metallic and oxide coatings. Measurement of coating thickness. Microscopical method
BS 4584:1970 Specification for metal clad base materials for printed circuits. Methods of test
BS 2011(1967) : LATEST

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