Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
  3.1 Terms and definitions
  3.2 Abbreviated terms
4 Verification
  4.1 Verification process
  4.2 Verification levels
  4.3 Verification plan
      4.3.1 Introduction
      4.3.2 Generation and updating
      4.3.3 Description
  4.4 Verification routes
  4.5 Classification of component type
  4.6 Single carrier
      4.6.1 General
      4.6.2 Margins
      4.6.3 Route to demonstrate conformance
  4.7 Multi-carrier
      4.7.1 General
      4.7.2 Threshold above equivalent CW peak power
      4.7.3 Threshold below equivalent CW peak power
      4.7.4 Route to demonstrate conformance
5 Design analyses
  5.1 General
  5.2 Field analysis
  5.3 Critical region identification
  5.4 Multipaction sensitivity analysis
  5.5 Venting analysis
  5.6 Inspection
6 Test conditions
  6.1 Cleanliness
  6.2 Pressure
  6.3 Temperature
  6.4 Frequencies
  6.5 Pulse duration
      6.5.1 General
      6.5.2 CW units
      6.5.3 Pulse units
  6.6 Electron seeding
      6.6.1 CW test
      6.6.2 Pulsed test
      6.6.3 Multi-carrier test
      6.6.4 Seeding sources
7 Methods of detection
  7.1 General
  7.2 Detection methods
  7.3 Detection method parameters
      7.3.1 Sensitivity
      7.3.2 Rise time
8 Test procedures
  8.1 Test configurations
  8.2 Test facility validation
  8.3 Test execution
      8.3.1 General
      8.3.2 Test procedure
  8.4 Acceptance criteria
      8.4.1 General
      8.4.2 Multi-carrier test
Annex A (informative) Multipaction background
      A.1 Physics of multipaction
      A.2 Other physical processes
      A.3 RF operating environment
      A.4 Parallel plate multipaction
      A.5 Coaxial line multipaction
Annex B (informative) Component venting
      B.1 Introduction
      B.2 Discharge dependence on pressure
      B.3 Test example
      B.4 Venting dimensions
      B.5 Venting hole calculations
      B.6 Payload vacuum
      B.7 Venting model used
      B.8 Pumping conductance of a venting hole
      B.9 Ultimate pressure
      B.10 Venting experiment
      B.11 Venting guidelines
Annex C (normative) Cleaning, handling, storage and contamination
      C.1 Generic processes
      C.2 Cleaning, handling and storage
      C.3 Contaminants
Annex D (normative) Electron seeding
      D.1 Introduction
      D.2 CW test
      D.3 Pulsed test
      D.4 Multi-carrier test
      D.5 Types of seeding source
Annex E (informative) Test methods
      E.1 Introduction
      E.2 General test methods
      E.3 Transient tests methods
      E.4 Test facility validation
Bibliography