Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-11-2011

Publisher

British Standards Institution

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Preconditioning
6 Preparation
7 Quick heating method
8 Synchronous method
9 Temperature profile method
Annex A (normative) - Equipment for the quick
        heating and synchronous method
Annex B (informative) - Reading of the output
        data and correction of the result in the
        quick heating test
Annex C (normative) - Test equipment for the
        temperature profile method
Annex D (informative) - Reading of the output
        data and correction of the result in the
        temperature profile test
Annex E (informative) - Caveats/Notes
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications
Bibliography

Gives methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Committee	EPL/501
DevelopmentNote	Supersedes 07/30165180 DC. (11/2011)
DocumentType	Standard
Pages	42
PublisherName	British Standards Institution
Status	Current
Supersedes	07/30165180 DC : 0

Standards	Relationship
IEC 60068-2-83:2011	Identical
EN 60068-2-83 : 2011	Identical

IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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BS EN 60068-2-83:2011

Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

Category

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