Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-06-2011

Publisher

British Standards Institution

INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Terminal position numbering
5 Drawings
6 Dimensions
7 Dimension table
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Gives outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Committee	EPL/47
DevelopmentNote	Supersedes 07/30155531 DC. (07/2011)
DocumentType	Standard
Pages	32
PublisherName	British Standards Institution
Status	Current
Supersedes	07/30155531 DC : 0

Standards	Relationship
IEC 60191-6-17:2011	Identical
EN 60191-6-17:2011	Identical

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6-5:2001	Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
EN 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-6-5:2001	Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

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BS EN 60191-6-17:2011

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory