Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine pitch land grid array (FLGA) - Proposed amendment on terminology

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

05-09-2001

Publisher

British Standards Institution

Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
  3.1 Flanged type
  3.2 Type of real chip size
  3.3 FLGA
  3.4 Material designation
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Gives common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0.80 mm and whose package body outline is square.

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

Committee	EPL/47
DevelopmentNote	Also numbered as IEC 60191-6-6. (09/2001)
DocumentType	Standard
Pages	16
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
DIN EN 60191-6-6:2002-02	Identical
SN EN 60191-6-6 : 2001	Identical
NF EN 60191-6-6 : 2002	Identical
UNE-EN 60191-6-6:2002	Identical
I.S. EN 60191-6-6:2001	Identical
EN 60191-6-6:2001	Identical

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BS EN 60191-6-6:2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine pitch land grid array (FLGA) - Proposed amendment on terminology

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Category

Subcategory