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BS EN 60286-4:2013

Current
Current

The latest, up-to-date edition.

Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-11-2013

1 Scope
2 Normative references
3 Terms, definitions and conventions
4 Shape and cross-section of stick magazine
5 Dimensions of stick magazines
6 Mechanical stability
7 End stoppers and spacers
8 Orientation of the components in the stick magazine
9 Marking
Annex A (informative) - DIL packages for through-hole mount
Annex B (informative) - SO packages for surface mounting
Annex C (informative) - Leaded chip carrier packages
        (PLCC) for surface mounting
Annex D (normative) - Rule for the orientation of integrated
        circuit packages in handling and shipping
        carriers such as stick magazines and rails
        (from IEC 60191-3:1999, Annex G)
Bibliography
Annex ZA (normative) - Normative references to international
         Publications with their corresponding
         European publications

Pertains to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant.

IEC 60286-4:2013 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant. They are also used to feed automatic placement machines for surface mounting as well as for through-hole mounting of electronic components. This edition includes the following significant technical changes with respect to the previous edition: Clause 4 describes the guidelines for customer specific stick magazine design. It replaces the magazine design rules for IEC outlined components and rules for orientation of components in stick magazines which have been moved to Annexes A to D.

Committee
W/-
DevelopmentNote
Supersedes 95/214364 DC. (07/2004) Renumbers and supersedes BS 6062-4(1991) 1997 version incorporates amendment 9687 to BS 6062-4(1991). (10/2005)
DocumentType
Standard
Pages
20
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
UNE-EN 60286-4:2000 Identical
DIN EN 60286-4:2014-04 Identical
NBN EN 60286-4 : 2014 Identical
IEC 60286-4:2013 Identical
SN EN 60286-4 : 1997 Identical
NF EN 60286-4 : 2014 Identical
EN 60286-4:2013 Identical
I.S. EN 60286-4:2013 Identical

ISO 11469:2016 Plastics — Generic identification and marking of plastics products
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
EN 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

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