BS EN 60749-20:2009

Superseded

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Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Available format(s)

Hardcopy , PDF

Superseded date

14-10-2020

Language(s)

English

Published date

31-01-2010

Publisher

British Standards Institution

1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
5 Procedure
6 Information to be given in the relevant specification
Annex A (informative) - Details and descriptions of test
        method on resistance of plastic encapsulated SMDs
        to the combined effect of moisture and soldering
        heat
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Defines a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).

IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows:
- to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C;
- reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1;
- update for lead-free solder;
- correct certain errors in the original Edition 1.

Committee	EPL/47
DevelopmentNote	Supersedes BS EN 60749. (09/2005) Supersedes 07/30168484 DC. (01/2010)
DocumentType	Standard
Pages	32
PublisherName	British Standards Institution
Status	Superseded
SupersededBy	BS EN IEC 60749-20:2020
Supersedes	07/30168484 DC : 0 BS EN 60749:1999 BS EN 60749-20:2003

Standards	Relationship
IEC 60749-20:2008	Identical
UNE-EN 60749-20:2004	Identical
DIN EN 60749-20:2010-04	Identical
NBN EN 60749-20 : 2010	Identical
EN 60749-20:2009	Identical
NF EN 60749-20 : 2010	Identical
I.S. EN 60749-20:2009	Identical

IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60749-35:2006	Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
IEC 60749-35:2006	Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
IEC 60749-3:2017	Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
EN 60749-3:2017	Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

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BS EN 60749-20:2009

Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory