Name: BS EN 61188-5-4:2007
Brand: BSI

Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides

Published date

31-12-2007

Publisher

British Standards Institution

INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Packaging
  3.4 Process considerations
4 Small outlined J packages (SOJ)
  4.1 Component description
  4.2 Component dimensions
  4.3 Solder joint fillet design
  4.4 Land pattern dimensions
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process.

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with \'J\' leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Committee	EPL/501
DevelopmentNote	Supersedes 95/208508 DC. (01/2008)
DocumentType	Standard
PublisherName	British Standards Institution
Status	Current
Supersedes	95/208508 DC : 0

Standards	Relationship
I.S. EN 61188-5-4:2007	Identical
IEC 61188-5-4:2007	Identical
EN 61188-5-4 : 2007	Identical
DIN EN 61188-5-4:2008-07	Identical
NF EN 61188-5-4 : 2016	Identical

EN 60286-5:2004/A1:2009	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 60286-5:2003+AMD1:2009 CSV	Packaging of components for automatic handling - Part 5: Matrixtrays
EN 60286-3:2013/AC:2013	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IEC 60286-3:2013	Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
EN 60286-4:2013	Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
IEC 60286-4:2013	Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms

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BS EN 61188-5-4:2007

Current

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory

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