Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-07-2013

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Terms and definitions
4 Summary of measuring methods
5 Test equipment
6 Calibration of the temperature
7 Procedure for the measuring method
Annex A (normative) - Test report on melting
        temperatures of solder alloys
Annex B (informative) - Examples of test result
        (Method A)
Annex C (informative) - Example of test result
        (Method B)
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

Committee	EPL/501
DevelopmentNote	Supersedes 09/30208696 DC. (07/2013)
DocumentType	Standard
Pages	20
PublisherName	British Standards Institution
Status	Current
Supersedes	09/30208696 DC : 0

Standards	Relationship
EN 61189-11 : 2013	Identical
IEC 61189-11:2013	Identical

EN ISO 11357-1:2016	Plastics - Differential scanning calorimetry (DSC) - Part 1: General principles (ISO 11357-1:2016)
IEC 61189-1:1997+AMD1:2001 CSV	Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
EN 61189-3:2008	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
EN ISO 9453:2014	Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
IEC 61189-3:2007	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
ISO 9453:2014	Soft solder alloys Chemical compositions and forms
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
ISO 11357-1:2016	Plastics — Differential scanning calorimetry (DSC) — Part 1: General principles
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

View more information

$294.12

Including GST where applicable

Product format

I agree to the DRM document license rules apply against the PDF selection made.

Please confirm that you agree to the document license rules for this document.

I agree to the document license rules .

Please confirm that you agree to the document license rules for this document.

Access your standards online with a subscription

Features

Simple online access to standards, technical information and regulations.
Critical updates of standards and customisable alerts and notifications.
Multi-user online standards collection: secure, flexible and cost effective.

Learn more on subscription solutions

Get in touch with us

Log into your Account

BS EN 61189-11:2013

Current

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory

Access your standards online with a subscription