Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-04-2016

Publisher

British Standards Institution

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test specimens
5 Test apparatus
6 Procedure
7 Report
8 Additional information
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Defines a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

This part of IEC61189 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

Committee	EPL/501
DevelopmentNote	Supersedes 13/30293995 DC. (04/2016)
DocumentType	Standard
Pages	18
PublisherName	British Standards Institution
Status	Current
Supersedes	13/30293995 DC : 0

Standards	Relationship
EN 61189-3-719:2016	Identical
IEC 61189-3-719:2016	Identical

IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions

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BS EN 61189-3-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory