Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

16-08-2002

Publisher

British Standards Institution

1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
  4.1 Conflict
  4.2 Flux classification and testing
5 Quality assurance provisions
  5.1 Responsibility for inspection
  5.2 Classification of inspections
  5.3 Materials inspection
  5.4 Quality inspection
  5.5 Performance inspection
  5.6 Quality conformance
  5.7 Preparation of fluxes for testing
6 Preparation for delivery
  6.1 Preservation-packing and packaging
7 Additional information
  7.1 Flux activity
  7.2 Flux and cleaning relationship
  7.3 Ordering data
Annex A (normative)
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography
Figures
Tables

Describes general requirements for the classifications and testing of soldering fluxes for high-quality interconnections in electronics assembly.

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

Committee	EPL/501
DevelopmentNote	Supersedes 98/231473 DC (09/2002)
DocumentType	Standard
Pages	26
PublisherName	British Standards Institution
Status	Current
Supersedes	98/231473 DC : JUL 98

Standards	Relationship
NF EN 61190-1-1 : 2002	Identical
DIN EN 61190-1-1:2003-01	Identical
I.S. EN 61190-1-1:2002	Identical
EN 61190-1-1:2002	Identical
IEC 61190-1-1:2002	Identical

IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
ISO 9454-2:1998	Soft soldering fluxes Classification and requirements Part 2: Performance requirements
EN ISO 9002:1994/AC:1997	QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION
ISO 9454-1:2016	Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
IEC 61189-6:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
ISO 9002:1994	Quality systems — Model for quality assurance in production, installation and servicing
EN 61189-3:2008	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61189-5:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
EN ISO 9455-16:2013	Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013)
IEC 61189-3:2007	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
ISO 9455-16:2013	Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
ISO 9001:2015	Quality management systems — Requirements
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
ISO 9453:2014	Soft solder alloys Chemical compositions and forms
IEC 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
ISO 9000:2015	Quality management systems — Fundamentals and vocabulary
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
EN 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
IEC 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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BS EN 61190-1-1:2002

Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

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