Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-06-2014

Publisher

British Standards Institution

IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material\'s performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of \'Reflow condition and profile\' in Annex B;
c) addition of a new Annex C.

Committee	EPL/501
DevelopmentNote	Supersedes 98/231474 DC. (08/2002) Supersedes 05/30133283 DC. (08/2007) Supersedes 12/30258438 DC. (06/2014)
DocumentType	Standard
Pages	26
PublisherName	British Standards Institution
Status	Current
Supersedes	12/30258438 DC : 0 BS EN 61190-1-2:2007 98/231474 DC : DRAFT JUL 1998 05/30133283 DC : DRAFT MAY 2005

Standards	Relationship
DIN EN 61190-1-2:2014-11	Identical
EN 61190-1-2:2014	Identical
NF EN 61190-1-2 : 2014	Identical
IEC 61190-1-2:2014	Identical
I.S. EN 61190-1-2:2014	Identical

IEC 61189-5-3:2015	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
ISO 9454-2:1998	Soft soldering fluxes Classification and requirements Part 2: Performance requirements
EN ISO 9454-2:2000	Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
IPC HDBK 005 : 0	GUIDE TO SOLDER PASTE ASSESSMENT
IEC 61189-6:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
EN 61189-5-3:2015	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
IEC 61189-5:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications