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IEC 61193-3:2013
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Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
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IEC 61193-1:2001
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Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
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IEC 61188-5-3:2007
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Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
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IEC 61188-5-2:2003
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Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
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IEC 60068-2-58:2015+AMD1:2017 CSV
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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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IEC 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
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IEC PAS 62326-7-1:2007
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Performance guide for single- and double-sided flexible printed wiring boards
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IPC J STD 001 : F
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
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IEC 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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IEC 62326-1:2002
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Printed boards - Part 1: Generic specification
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IPC J STD 006 : C
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REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
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IPC J STD 004 : B
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REQUIREMENTS FOR SOLDERING FLUXES
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IPC TM 650 : 0
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TEST METHODS MANUAL
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IEC 62326-4:1996
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Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
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IPC A 610 : F
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ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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IPC J STD 005 : A
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REQUIREMENTS FOR SOLDERING PASTES
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IPC J STD 002 : D
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SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
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IEC 61188-7:2017
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Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
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IEC 61191-1:2013
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Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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IEC 61188-5-6:2003
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Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
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IEC 61188-5-1:2002
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Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
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IEC 60194:2015
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Printed board design, manufacture and assembly - Terms and definitions
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IEC 61188-5-5:2007
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Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
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ISO 9001:2015
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Quality management systems — Requirements
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IEC 62326-4-1:1996
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Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
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IPC OI 645 : 0
|
STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
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EN 61191-1:2013
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PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
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IEC 61188-5-4:2007
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Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
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IPC J STD 003 : C
|
SOLDERABILITY TESTS FOR PRINTED BOARDS
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|
IPC SM 817 : A
|
GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
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IEC 61189-2:2006
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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|
IPC 9191 : 0
|
GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
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