Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-06-1999

Publisher

British Standards Institution

Applies to electrical and/or electronic equipment that have a rated input current up to 16 A per phase. Aims to establish a reference for evaluating the immunity of electric and/or electronic equipment when subjected to positive and negative low amplitude voltage fluctuations. Only conducted phenomena are considered, including immunity tests for equipment connected to public and industrial power supply networks. Has the status of a Basic EMC publication. This consolidated version consists of the first edition (1999) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.

Committee	EPL/501
DevelopmentNote	Also numbered as IEC 61249-2-13 Supersedes 95/208513 DC (08/2004)
DocumentType	Standard
Pages	20
PublisherName	British Standards Institution
Status	Current
Supersedes	95/208513 DC : JUL 95

Standards	Relationship
SN EN 61249-2-13 : 1999	Identical
EN 61249-2-13:1999	Identical
UNE-EN 61249-2-13:2001	Identical
NF EN 61249-2-13 : 2002	Identical
DIN EN 61249-2-13:1999-11	Identical
I.S. EN 61249-2-13:1999	Identical

BS 6221-21:2001

Printed wiring boards Guide to the rework of unassembled boards

EN 61249-5-1:1996	Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61189-1:1997+AMD1:2001 CSV	Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
IEC 61249-5-1:1995	Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61189-3:2007	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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BS EN 61249-2-13:1999

Current

Scope

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

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