BS EN 61760-1:2006

Superseded

View Superseded by

Surface mounting technology Standard method for the specification of surface mounting components (SMDs)

Available format(s)

Hardcopy , PDF

Superseded date

02-10-2020

Language(s)

English

Published date

29-09-2006

Publisher

British Standards Institution

INTRODUCTION
1 Scope and object
  1.1 Scope
  1.2 Object
2 Normative references
3 Terms and definitions
4 Requirements for component design and component
  specifications
  4.1 General requirement
  4.2 Packaging
  4.3 Labelling of product packaging
  4.4 Component marking
  4.5 Storage and transportation
  4.6 Component outline and design
  4.7 Mechanical stress
  4.8 Component reliability assurance
  4.9 Additional requirements for compatibility with
      lead-free soldering
5 Specification of assembly process conditions
  5.1 General
  5.2 Securing the component on the substrate prior
      to soldering
  5.3 Mounting methods
  5.4 Cleaning (where applicable)
  5.5 Removal and/or replacement of SMDs
6 Typical process conditions
  6.1 Soldering processes, temperature/time profiles
  6.2 Typical cleaning conditions for assemblies
7 Requirements for components and component specifications
  related to suitability with various mounting processes
  7.1 General
  7.2 Wettability
  7.3 Resistance to dissolution of metallization
  7.4 Resistance to soldering heat
  7.5 Resistance to cleaning solvent
  7.6 Soldering profiles
  7.7 Bonding strength test for the component glue interface
      test
Bibliography
Annex ZA (normative) Normative references to international
                     publications with their corresponding
                     European publications

Provides a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.

IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component\'s ability to withstand resistance to soldering heat has been deleted.

Committee	EPL/501
DocumentType	Standard
Pages	34
PublisherName	British Standards Institution
Status	Superseded
SupersededBy	BS EN IEC 61760-1:2020
Supersedes	BS EN 61760-1:1999

Standards	Relationship
EN 61760-1:2006	Identical
DIN EN 61760-1:2006-10	Identical
NBN EN 61760-1 : 2007	Identical
IEC 61760-1:2006	Identical
I.S. EN 61760-1:2006	Identical
SN EN 61760-1 : 1998	Identical
NF EN 61760-1 : 2014	Identical

BS 6221-25:2000

Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies

EN 60286-5:2004/A1:2009	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
EN 60286-6:2004	Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 61340-5-3:2015	Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices
EN 61340-5-1:2016/AC:2017-05	ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 62090:2017	Product package labels for electronic components using bar code and two-dimensional symbologies
IEC 60068-2-21:2006	Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60286-6:2004	Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
EN 62090:2017	Product package labels for electronic components using bar code and two- dimensional symbologies
IEC 60286-5:2003+AMD1:2009 CSV	Packaging of components for automatic handling - Part 5: Matrixtrays
IEC 61760-2:2007	Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
EN 60286-3:2013/AC:2013	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
ISO 8601:2004	Data elements and interchange formats Information interchange Representation of dates and times
IEC 60068-2-77:1999	Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
EN 60068-2-21:2006	Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 60062:2016	Marking codes for resistors and capacitors
EN 60062:2016/AC:2016-12	MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016)
EN 60068-2-77:1999	Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
EN 61760-2:2007	Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 60286-3:2013	Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
EN 60286-4:2013	Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
EN 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60286-4:2013	Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
EN 60068-2-45:1992/A1:1993	Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
IEC 60068-2-69:2017	Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions

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BS EN 61760-1:2006

Superseded

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

Category

Subcategory

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