Semiconductor devices. Micro-electromechanical devices Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-10-2013

Publisher

British Standards Institution

1 Scope
2 Normative References
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Test piece fabrication
Annex B (informative) - Test piece handling example
Annex C (informative) - Test piece releasing process
Annex D (informative) - Out-of-plane test setup
        and test piece example
Annex E (informative) - Data analysis example in
        in-plane test method
Annex F (informative) - Data analysis example in
        out-of-plane test method
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 [mu]m and 1 mm and thickness between 0,1 [mu]m and 1 mm, which are main structural materials used for MEMS, micromachines and others.

IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 micrometre and 1 mm and thickness between 0,1 micrometre and 1 mm, which are main structural materials used for MEMS, micromachines and others. This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30 % of a material\'s melting temperature.

Committee	EPL/47
DevelopmentNote	Supersedes 10/30211446 DC. (10/2013)
DocumentType	Standard
Pages	24
PublisherName	British Standards Institution
Status	Current
Supersedes	10/30211446 DC : 0

Standards	Relationship
IEC 62047-11:2013	Identical
EN 62047-11 : 2013	Identical

ASTM E 228 : 2017 : REDLINE	Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push-Rod Dilatometer
IEC 62047-3:2006	Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
EN 62047-3 : 2006	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
ASTM E 289 : 2017 : REDLINE	Standard Test Method for Linear Thermal Expansion of Rigid Solids with Interferometry

View more information

$407.85

Including GST where applicable

Product format

I agree to the DRM document license rules apply against the PDF selection made.

Please confirm that you agree to the document license rules for this document.

I agree to the document license rules .

Please confirm that you agree to the document license rules for this document.

Access your standards online with a subscription

Features

Simple online access to standards, technical information and regulations.
Critical updates of standards and customisable alerts and notifications.
Multi-user online standards collection: secure, flexible and cost effective.

Learn more on subscription solutions

Get in touch with us

Log into your Account

BS EN 62047-11:2013

Current

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory

Access your standards online with a subscription