Semiconductor devices. Micro-electromechanical devices RF MEMS switches

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-04-2013

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Terms and definitions
4 Essential ratings and characteristics
5 Measuring methods
6 Reliability (performance)
Annex A (informative) - General description of RF MEMS
        Switches
Annex B (informative) - Geometry of RF MEMS switches
Annex C (informative) - Packaging of RF MEMS switches
Annex D (informative) - Failure mechanism of RF MEMS switches
Annex E (informative) - Applications of RF MEMS switches
Annex F (informative) - Measurement procedure of RF MEMS
        switches
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Specifies terminology, definition, symbols, test methods that can be used to evaluate and determine the essential ratings and characteristic parameters of RF MEMS switches.

This part of IEC 62047 describes terminology, definition, symbols, test methods that can be used to evaluate and determine the essential ratings and characteristic parameters of RF MEMS switches. The statements made in this standardization are also applicable to RF (Radio Frequency) MEMS (Micro-Electro-Mechanical Systems) switches with various structures, contacts (d.c. contact and capacitive contact), configurations (series and shunt), switching networks (SPST, SPDT, DPDT, etc.), and actuation mechanism such as electrostatic, electro-thermal, electromagnetic, piezoelectric, etc. The RF MEMS switches are promising devices in advanced mobile phones with multi-band/mode operation, smart radar systems, reconfigurable RF devices and systems, SDR (Software Defined Radio) phones, test equipments, tunable devices and systems, satellite, etc.

Committee	EPL/47
DevelopmentNote	Supersedes 07/30172155 DC. (09/2011)
DocumentType	Standard
Pages	38
PublisherName	British Standards Institution
Status	Current
Supersedes	07/30172155 DC : DRAFT OCT 2007

Standards	Relationship
IEC 62047-5:2011/COR1:2012	Identical
EN 62047-5:2011	Identical
IEC 62047-5:2011	Identical

IEC 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-27:2006+AMD1:2012 CSV	Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV	Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
EN 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
EN 60749-27:2006/A1:2012	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - MACHINE MODEL (MM)
EN 60749-10:2002	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60747-1:2006+AMD1:2010 CSV	Semiconductor devices - Part 1: General
EN 60747-16-1:2002/A2:2017	SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017)
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV	Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
IEC 60749-10:2002	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-12:2002	Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
EN 60749-12:2002	Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

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BS EN 62047-5:2011

Current

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

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