Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-10-2007

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
   5.1 Flow soldering equipment
   5.2 Reflow soldering equipment
   5.3 Pull strength test equipment
   5.4 Optical microscope
   5.5 Test substrate
   5.6 Solder alloy
   5.7 Flux for flow soldering
   5.8 Solder paste
6 Mounting method
   6.1 Flow soldering
   6.2 Reflow soldering
7 Test conditions
   7.1 Test: Rapid change of temperature
   7.2 Pull strength test
8 Test procedure
   8.1 Test sequence
   8.2 Pre-conditioning
   8.3 Initial pull strength measurement
   8.4 Rapid change of temperature
   8.5 Recovery
   8.6 Intermediate/final pull strength measurement
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) - Pull strength test - Details
Bibliography
Annex ZA (normative) - Normative references to international
                       publications with their corresponding
                       European publications

Applies to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress.

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Committee	EPL/501
DevelopmentNote	Supersedes 05/30133278 DC. (10/2007)
DocumentType	Standard
Pages	18
PublisherName	British Standards Institution
Status	Current
Supersedes	05/30133278 DC : DRAFT MAY 2005

Standards	Relationship
NF EN 62137-1-1 : 2014	Identical
DIN EN 62137-1-1:2008-02	Identical
EN 62137-1-1 : 2007	Identical
IEC 62137-1-1:2007	Identical
I.S. EN 62137-1-1:2007	Identical

IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61249-2-7:2002	Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 60068-2-21:2006	Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
EN 61249-2-7:2002/corrigendum:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 61188-5-5:2007	Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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BS EN 62137-1-1:2007

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Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

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