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BS IEC 60748-23-2:2002

Current
Current

The latest, up-to-date edition.

Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Internal visual inspection and special tests
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

21-06-2002

Applies to high quality approval systems for hybrid integrated circuits and film structures. The purpose of the tests is to perform visual inspections on the internal materials, construction and workmanship of hybrid, multichip and multichip module microcircuits and passive elements used for microelectronic applications including r.f./microwave. These tests will normally be used on microelectronic devices prior to capping or encapsulation to detect and eliminate devices with internal non-conformances that could lead to device failure in normal application. They may also be employed on a sampling basis to determine the effectiveness of the manufacturers\' quality control and handling procedures.

Committee
EPL/47
DevelopmentNote
To be read in conjunction with BS IEC 60748-23-1, BS IEC 60748-23-3 and BS IEC 60748-23-4 Supersedes 94/216399 DC (07/2002)
DocumentType
Standard
Pages
100
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
IEC 60748-23-2:2002 Identical

EN 100012 : 1995 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: X-RAY INSPECTION OF ELECTRONIC COMPONENTS
IEC 60748-23-1:2002 Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
IEC 60748-23-4:2002 Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General
IEC 60748-23-3:2002 Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report

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