Adhesives. Test methods for isotropic electrically conductive adhesives Determination of high-speed signal-transmission characteristics

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-06-2014

Publisher

British Standards Institution

Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Principle
5 Apparatus and test circuit board
6 Preparation of test circuit board
7 Set-up
8 Tests
9 Test report
Annex A (normative) - Sample structure used for the
        examination
Annex B (normative) - Test procedure
Annex C (normative) - Test equipment and example
        of implementation of the test
Annex D (normative) - Application procedure for
        isotropic electrically conductive
        adhesive - Example
Annex E (normative) - Application of isotropic
        electrically conductive
        adhesive - Measurement example
Bibliography

Defines test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board.

This part of ISO16525 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on the printed circuit board.

Committee	PRI/52
DevelopmentNote	Supersedes 12/30254697 DC. (06/2014)
DocumentType	Standard
Pages	54
PublisherName	British Standards Institution
Status	Current
Supersedes	12/30254697 DC : 0

Standards	Relationship
ISO 16525-9:2014	Identical

IEC 61188-5-3:2007	Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
IEC 61188-5-2:2003	Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002	Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
ISO 472:2013	Plastics Vocabulary
IEC 61188-5-6:2003	Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
IEC 61192-1:2003	Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 61188-5-5:2007	Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
IEC 61188-5-4:2007	Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
IEC 61249-2-8:2003	Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

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BS ISO 16525-9:2014

Current

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

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