BS PD IEC 62239 : 2001

FOREWORD
ELECTRONIC COMPONENT MANAGEMENT PLANS
Purpose
1 Scope
2 References
  2.1 Normative References
  2.2 Informative References
3 Terms and Definitions
4 Technical Requirements
  4.1 Component Application
   4.1.1 Functionality
   4.1.2 Electromagnetic Compatibility
   4.1.3 De-rating and Stress Analysis
   4.1.4 Thermal Analysis
   4.1.5 Mechanical Analysis
   4.1.6 Producibility
   4.1.7 Testing, Testability, and Maintainability
   4.1.8 Avionics Radiation Environment
   4.1.9 Toxic Emissions
  4.2 General Qualification Requirements
   4.2.1 Component Manufacturer Qualification
   4.2.2 Qualifying Components from Qualified Component
         Manufacturers
   4.2.3 Qualifying Components from Component
         Manufacturers Who have Not been Qualified
  4.3 Component Quality Assurance
   4.3.1 General Quality Assurance Requirements
   4.3.2 Component Quality Assurance Methods
   4.3.3 Component Design and Manufacturing Process
         Change Monitoring
   4.3.4 Failure Disposition
  4.4 Component Compatibility with the Equipment
      Manufacturing Process
  4.5 Component Data
  4.6 Configuration Control
   4.6.1 Component Selection
   4.6.2 Component Substitution
   4.6.3 Change Documentation
   4.6.4 Customer Notifications and Approvals
   4.6.5 Focal Organization
  4.7 Component Dependability
   4.7.1 Component Reliability
   4.7.2 Component Availability
   4.7.3 Component Obsolescence
    4.7.3.1 Component Obsolescence Awareness
    4.7.3.2 Reaction to Component Obsolescence
    4.7.3.3 Pro-active Measures for Component
            Obsolescence
5 Plan Administration Requirements
  5.1 Using Components Outside the Manufacturers
      Specified Temperature Range
  5.2 Plan Organization
  5.3 Plan Terms and Definitions
  5.4 Plan Focal
  5.5 Plan References
  5.6 Plan Applicability
  5.7 Plan Implementation
  5.8 Plan Acceptance