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PD IEC/TS 62239-1:2015

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan
Available format(s)

Hardcopy , PDF

Superseded date

13-12-2018

Language(s)

English

Published date

30-04-2015

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technical requirements
5 Plan administration requirements
Annex A (informative) - Requirement matrix for IEC TS
        62239-1
Annex B (informative) - Typical qualification requirements
        and typical component minimum qualification
        requirements
Annex C (informative) - Semiconductor reliability and
        wear out
Annex D (informative) - Guidelines for environmental
        protection techniques and for comparison of
        components specifications
Bibliography

Specifies the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements.

This part of IEC62239 , which is a technical specification, defines the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause4 are accomplished. In general, the plan owner of a complete Electronic Components Management Plan is the avionics original equipment manufacturer (OEM). This document provides an aid in the aerospace certification process. Although developed for the avionics industry, this process may be applied by other industrial sectors.

Committee
GEL/107
DevelopmentNote
Supersedes DD IEC/TS 62239. (08/2012)
DocumentType
Standard
Pages
82
PublisherName
British Standards Institution
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
IEC TS 62239-1:2015 Identical

SAE AS 5553B : 2016 COUNTERFEIT ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION
GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
GEIA STD 0005-3 : 2013 PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES
MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
IECQ 001003:1998 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - GUIDANCE DOCUMENTS
IEC 61967-1:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
MIL-PRF-19500 Revision P:2010 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
ISO/TS 16949:2009 Quality management systems Particular requirements for the application of ISO 9001:2008 for automotive production and relevant service part organizations
IEC TS 62668-2:2016 Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
IEC TR 61340-5-2:2007 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
IEC TS 62668-1:2016 Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
RTCA DO 254 : 2000 DESIGN ASSURANCE GUIDANCE FOR AIRBORNE ELECTRONIC HARDWARE
SAE J 1752/3 : 2011 MEASUREMENT OF RADIATED EMISSIONS FROM INTEGRATED CIRCUITS - TEM/WIDEBAND TEM (GTEM) CELL METHOD; TEM CELL (150 KHZ TO 1 GHZ), WIDEBAND TEM CELL (150 KHZ TO 8 GHZ)
IEC TR 62240-1:2013 Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
ESDA/JEDEC JS-001 : 2017 ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL
IEC Q 01 : 5.0 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - BASIC RULES
IEC QC 001004 : 2.0
GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
SAE AS 9000 APPENDIX 1 : 1998 AS 9000 AUDIT SUMMARY AND SUPPLIER PROFILE INSTRUCTIONS
IEC TS 62647-3:2014 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
IEC 62396-4:2013 Process management for avionics - Atmospheric radiation effects - Part 4: Design of high voltage aircraft electronics managing potential single event effects
GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
ISO 9004:2009 Managing for the sustained success of an organization A quality management approach
MIL-HDBK-263 Revision B:1994 ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL & ELECTRONIC PARTS, ASSEMBLIES & EQUIPMENT
IEC TS 62564-1:2016 Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
IEC Q 03-4 : 3.0 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 4: IECQ AVIONICS SCHEME - AVIONICS PARTS AND ASSEMBLY MANAGEMENT
GEIA STD 0016 : 2012 PREPARING A DMSMS MANAGEMENT PLAN
IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
IEC 62396-5:2014 Process management for avionics - Atmospheric radiation effects - Part 5: Assessment of thermal neutron fluxes and single event effects in avionics systems
IEC 62396-3:2013 Process management for avionics - Atmospheric radiation effects - Part 3: System design optimization to accommodate the single event effects (SEE) of atmospheric radiation
ISO 9001:2015 Quality management systems — Requirements
GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
MIL-PRF-38535 Revision K:2013 Integrated Circuits (Microcircuits) Manufacturing, General Specification for
SAE AS 6496 : 2014 FRAUDULENT/COUNTERFEIT ELECTRONIC PARTS: AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION - AUTHORIZED/FRANCHISED DISTRIBUTION
AIAA R 100 : A 2001 RECOMMENDED PRACTICE FOR PARTS MANAGEMENT
MIL-STD-3018 Base Document:2007 Parts Management (S/S by MIL-STD-11991)
IEC 62396-1:2016 Process management for avionics - Atmospheric radiation effects - Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment
GEIA STD 0002-1 : 2005 AEROSPACE QUALIFIED ELECTRONIC COMPONENT (AQEC) REQUIREMENTS, VOLUME 1 - INTEGRATED CIRCUITS AND SEMICONDUCTORS
IEC 60695-11-5 : 2.0 FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
IEC 60695-11-5:2016 Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance
IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
EN 190000:1995 Generic Specification: Monolithic integrated circuits
EIA 4899 : 2001 STANDARD FOR PREPARING AN ELECTRONIC COMPONENTS MANAGEMENT PLAN

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