Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-10-2013

Publisher

British Standards Institution

This part of IEC 62647 is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment manufacturers (OEMs) and system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as ADHP) both during and after the transition to Pb-free electronics.

The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to ensure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with IEC/TS 62647-1:2012.

This document also contains lessons learned from previous experience with Pb-free aerospace electronic systems. The lessons learned give specific references to solder alloys and other materials, and their expected applicability to various operating environmental conditions. The lessons learned are intended for guidance only; they are not guarantees of success in any given application.

This document may be used by other high-performance and high-reliability industries, at their discretion.

Committee	GEL/107
DocumentType	Standard
Pages	74
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
IEC TS 62647-22:2013	Identical

IPC J STD 609 : A	MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
IPC 4552 : 0	PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS
IPC 6011 : 0	GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
IPC 4553 : A	SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IEC PAS 62647-3:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC JP002 : 0	JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
IPC CC 830 : B	QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
MIL-I-46058 Revision C:1972	Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
ASTM G 85 : 2011 : REDLINE	Standard Practice for Modified Salt Spray (Fog) Testing
IPC J STD 006 : C	REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC TM 650 : 0	TEST METHODS MANUAL
IEC TS 62647-21:2013	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
IPC J STD 033C-1:2014	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
GEIA HB 0005-3 : 2008	REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
IPC A 610 : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
GEIA STD 0005-2 : 2012	MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
IEC PAS 62647-23:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IPC J STD 002 : D	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 1066 : 0	MARKING, SYMBOLS AND LABELS FOR IDENTIFICATION OF LEAD-FREE AND OTHER REPORTABLE MATERIALS IN LEAD-FREE ASSEMBLIES, COMPONENTS AND DEVICES
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
IEC TS 62647-1:2012	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
IPC 9201 : A	SURFACE INSULATION RESISTANCE HANDBOOK
IPC 9701 : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
GEIA STD 0006 : 2008	REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
IPC 4554 : 0	SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
ARINC 671 : 2006	GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC 1752 : A-2	MATERIALS DECLARATION MANAGEMENT
IEC TS 62647-2:2012	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
IPC 6012 : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS