RELIABILITY STRESS SCREENING - PART 2: ELECTRONIC COMPONENTS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2000

Publisher

Comitato Elettrotecnico Italiano

Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
4 Procedure
Annex A (informative) - Examples of tools for
         identifying failure mechanisms in
         electronic components
Annex B (informative) - Data analysis
Annex C (informative) - Examples of applications
        of reliability stress screening processes

Gives a guide on reliability stress screening techniques and procedures for electronic components. This standard is meant for the use of component manufacturers as a guideline, and component users as a guideline for negotiating with component manufacturers on stress screening requirements also subcontractors who give stress screening as a service.

Committee	CT 56
DocumentType	Standard
Pages	38
PublisherName	Comitato Elettrotecnico Italiano
Status	Current
SupersededBy	CEI EN IEC 61163-2:2020

Standards	Relationship
IEC 61163-2:1998	Identical

IEC 61163-1:2006	Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
IEC 60300-1:2014	Dependability management - Part 1: Guidance for management and application
IEC 60300-3-7:1999	Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware
IEC 61709 : 3.0	ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
IEC 60300-2:2004	Dependability management - Part 2: Guidelines for dependability management

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CEI 56-36 : 2000

Current

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory

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