SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2004

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Summary

Describes a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-38. (01/2005) Supersedes CEI EN 60749. (05/2008)
DocumentType	Standard
Pages	20
PublisherName	Comitato Elettrotecnico Italiano
Status	Current
Supersedes	CEI EN 60749 : 2000 AMD 2 2004

Standards	Relationship
EN 60749-25:2003	Identical
IEC 60749-25:2003	Identical

IEC 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature

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CEI EN 60749-25 : 2004

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory