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IEC 60068-2-82:2007
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Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
|
|
EN 60286-5:2004/A1:2009
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PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
|
|
IEC 60749-20:2008
|
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
|
|
IEC 60068-2-58:2015+AMD1:2017 CSV
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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
|
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IEC 60068-2-20:2008
|
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
|
|
EN 60068-2-20:2008
|
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
|
|
IEC 62090:2017
|
Product package labels for electronic components using bar code and two-dimensional symbologies
|
|
CEI 40-10 : 2ED 1998
|
IMBALLAGGIO DI COMPONENTI PER OPERAZIONI AUTOMATIZZATE - PARTE 3: IMBALLAGGIO DI COMPONENTI SENZA REOFORI SU NASTRI CONTINUI
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|
IEC 60068-2-21:2006
|
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
|
|
EN 62090:2017
|
Product package labels for electronic components using bar code and two- dimensional symbologies
|
|
IEC 60286-5:2003+AMD1:2009 CSV
|
Packaging of components for automatic handling - Part 5: Matrixtrays
|
|
IEC 61760-2:2007
|
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
|
|
EN 60286-3:2013/AC:2013
|
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
|
|
ISO 8601:2004
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Data elements and interchange formats Information interchange Representation of dates and times
|
|
IEC 60068-2-77:1999
|
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
|
|
EN 60068-2-21:2006
|
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
|
|
IEC 60194:2015
|
Printed board design, manufacture and assembly - Terms and definitions
|
|
IEC 60062:2016
|
Marking codes for resistors and capacitors
|
|
EN 60062:2016/AC:2016-12
|
MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016)
|
|
EN 60068-2-77:1999
|
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
|
|
EN 61760-2:2007
|
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
|
|
EN 60068-2-82:2007
|
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
|
|
EN 60749-20:2009
|
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
|
|
IEC 60286-3:2013
|
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
|
|
EN 60286-4:2013
|
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
|
|
IEC 60286-4:2013
|
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
|
|
EN 60068-2-45:1992/A1:1993
|
Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
|
|
EN 60194:2006
|
Printed board design, manufacture and assembly - Terms and definitions
|
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