TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2014

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Method of erosion depth measurement (focal depth
  method with optical microscope)
6 Items to be recorded in test report
Annex A (normative) - Specifications of test equipment
        & measurement equipment
Annex B (informative) - Method of estimation of
        maximum erosion depth by extreme value
        statistical analysis
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

Committee	CT 309
DevelopmentNote	Classificazione CEI 91-77. (05/2014)
DocumentType	Standard
Pages	26
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
IEC 62739-1:2013	Identical
EN 62739-1 : 2013	Identical

IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
ISO 16143-3:2014	Stainless steels for general purposes Part 3: Wire
EN 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
ISO 16143-2:2014	Stainless steels for general purposes Part 2: Corrosion-resistant semi-finished products, bars, rods and sections
ISO 16143-1:2014	Stainless steels for general purposes Part 1: Corrosion-resistant flat products
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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CEI EN 62739-1 : 2014

TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING

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Abstract

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