Name: CEI EN 62739-2 : 1ED 2017
Brand: CEI

TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING

Published date

25-07-2017

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Erosion depth measurement
6 Items to be recorded in test report
Annex A (normative) - Specifications of test equipment and
        measurement equipment
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Specifies an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

Committee	CT 309
DevelopmentNote	Classificazione CEI 91-91. (07/2017)
DocumentType	Standard
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
IEC 62739-2:2016	Identical
EN 62739-2:2016	Identical

EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications