DD IEC PAS 62647-3 : DRAFT SEP 2011

Name: DD IEC PAS 62647-3 : DRAFT SEP 2011
Brand: BSI

Withdrawn

View Superseded by

PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES

Withdrawn date

27-10-2018

Published date

23-11-2012

Publisher

British Standards Institution

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and Definitions
4 Default Test Methods
5 Protocol to Design and Conduct Performance Tests
6 Final Remarks
Annex A (informative) - Test Sample Size
Annex B (informative) - Material Properties of Lead-free
        (Pb-free) Solder Materials
Annex C (informative) - NASA-DoD Lead-free (Pb-free)
        Electronics Project Test Information (from the
        NASA-DoD Lead-free (Pb-free) Project Joint
        Test Protocol, September 2007)

Specifies for circuit card assemblies (CCA): - a default method for those companies that require a pre-defined approach, and - a protocol for those companies that wish to develop their own test methods.

Committee	GEL/107
DocumentType	Draft
PublisherName	British Standards Institution
Status	Withdrawn
SupersededBy	PD IEC/TS 62647-3:2014

Standards	Relationship
IEC PAS 62647-3:2011	Identical

IEC PAS 62647-2:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin
GEIA HB 0005-2 : 2007	TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
MIL-STD-810 Revision G:2008	ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS
IPC 9703 : 0	IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY
IEC PAS 62647-1:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
IEC PAS 62647-22:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
GEIA STD 0005-2 : 2012	MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
GEIA HB 0005-1 : 2006	PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
MIL-HDBK-217 Revision F:1991	RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
IPC 9701 : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IEC PAS 62647-21:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
IPC SM 785 : 0	GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS