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DIN EN 60749-14:2004-07

Current
Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2004

FOREWORD
1 Scope
2 Normative references
3 General
4 Test condition A - Tension
5 Test condition B - Bending stress
6 Test condition C - Lead fatigue
7 Test condition D - Lead torque
8 Test condition E - Stud torque
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

DevelopmentNote
Supersedes DIN EN 60749. (06/2005)
DocumentType
Standard
Pages
19
PublisherName
German Institute for Standardisation (Deutsches Institut für Normung)
Status
Current
Supersedes

Standards Relationship
UNE-EN 60749-14:2004 Identical
NF EN 60749-14 : 2004 Identical
IEC 60749-14:2003 Identical
BS EN 60749-14:2003 Identical
NBN EN 60749-14 : 2004 Identical
I.S. EN 60749-14:2003 Identical
EN 60749-14:2003 Identical

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