DIN EN 61190-1-3:2015-05 (Draft)

Superseded

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

Available format(s)

Hardcopy , PDF

Superseded date

07-03-2021

Language(s)

German

Published date

01-01-2015

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

1 Scope
2 Normative references
3 Classification
  3.1 Alloy composition
  3.2 Solder form
  3.3 Flux type
  3.4 Flux percentage and metal content
  3.5 Other characteristics
4 Terms and definitions
5 Requirements
  5.1 Materials
  5.2 Alloys
  5.3 Solder forms
  5.4 Flux type and form
  5.5 Flux residue dryness
  5.6 Spitting
  5.7 Solder-pool
  5.8 Labelling for product identification
  5.9 Workmanship
6 Quality assurance provisions
  6.1 Responsibility for inspection and compliance
  6.2 Classification of inspections
  6.3 Material inspection
  6.4 Qualification inspection
  6.5 Quality conformance
  6.6 Preparation of solder alloy for test
7 Preparation for delivery
  7.1 Preservation, packing, and packaging
Annex A (informative)
  A.1 Intended use
  A.2 Acquisition requirements
  A.3 Standard solder product packages
  A.4 Protocol for establishing short names for
      IEC 61190-1-3 alloys
  A.5 Standard description of solid solder products
Annex B (normative) Solder alloys
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

DevelopmentNote	Supersedes DIN IEC 91-149-CD. (01/2003) Supersedes DIN IEC 61190-1-3 and DIN IEC 61190-1-3:DRAFT AMD 1 issue 11-2008. (04/2011) DRAFT 2015 issued in May 2015. (05/2015)
DocumentType	Draft
Pages	72
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Superseded
Supersedes	DIN IEC 61190-1-3:2005-09 (Draft)

Standards	Relationship
I.S. EN 61190-1-3:2007	Identical
NF EN 61190-1-3 : 2008 AMD 1 2010	Identical
IEC 61190-1-3:2007+AMD1:2010 CSV	Identical
BS EN 61190-1-3 : 2007	Identical
EN 61190-1-3:2007/A1:2010	Identical

VDE 0468-2-69 : 2018	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
DIN EN 60068-2-69 : 2007	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)