DIN EN 61192-4:2003-11

Withdrawn

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies (IEC 61192-4:2002); German version EN 61192-4:2003

Available format(s)

Hardcopy , PDF

Withdrawn date

26-06-2022

Language(s)

German

Published date

01-11-2003

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
   4.1 Classification
   4.2 Conflict
   4.3 Inspection technique
   4.4 Interpretation of requirements
5 Process characterization
   5.1 Wire preparation processes
   5.2 Terminal mounting processes
   5.3 Soldering terminal
   5.4 Solderability
   5.5 Preconditioning
   5.6 Mechanical securing
6 Wire preparation attributes
   6.1 Insulation stripping
   6.2 Twisted strands
7 Connector pins and terminals
   7.1 Soldered connector pins
8 Discrete wiring (jumper wires)
   8.1 Wire selection
   8.2 Wire routing
   8.3 Staking
   8.4 Termination
9 Discrete wiring (jumper wires) attributes
10 Solder joint acceptance
   10.1 Post terminations
Figures
Table

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

DevelopmentNote	Supersedes DIN IEC 91-160-CD (12/2003)
DocumentType	Standard
Pages	29
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Withdrawn

Standards	Relationship
IEC 61192-4:2002	Identical
BS EN 61192-4:2003	Identical
EN 61192-4:2003	Identical
I.S. EN 61192-4:2003	Identical
NF EN 61192-4 : 2003	Identical
NBN EN 61192-4 : 2004	Identical