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  • DIN EN ISO 9453:2014-12

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)

    Available format(s):  Hardcopy, PDF

    Superseded date:  04-01-2021

    Language(s):  German, English

    Published date:  01-12-2014

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes DIN EN 29453. (12/2006)
    Document Type Standard
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    DKI I 003 : 2015
    DIN DVS HDBK 196/2 : 3ED 2017
    DIN 17007-4:2012-12 MATERIAL NUMBERS - PART 4: SYSTEM OF THE PRINCIPAL GROUPS 2 AND 3: NON-FERROUS METALS
    DKI I 164 : 2017 KUPFERROHRE IN DER KAELTE-KLIMATECHNIK, FUER TECHNISCHE UND MEDIZINISCHE GASE
    DIN 50930-6:2013-10 Corrosion of metals - Corrosion of metallic materials under corrosion load by water inside of pipes, tanks and apparatus - Part 6: Evaluation process and requirements regarding the hygienic suitability in contact with drinking water
    DIN HDBK 459/2 : 2ED 2012
    DIN 18339:2016-09 GERMAN CONSTRUCTION CONTRACT PROCEDURES (VOB) - PART C: GENERAL TECHNICAL SPECIFICATIONS IN CONSTRUCTION CONTRACTS (ATV) - SHEET METAL ROOFING AND WALL COVERING WORK
    DIN EN ISO 9455-10:2013-01 Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012)
    DIN EN ISO 9455-16:2013-08 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013)

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 3677:2016 Filler metal for soldering and brazing Designation
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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