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DOD-STD-2000-2 Revision A:1986

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

PART AND COMPONENT MOUNTING FOR HIGH QUALITY/HIGH RELIABILITY SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
Available format(s)

PDF

Superseded date

17-10-1994

1 SCOPE
  1.1 Applicability
2 REFERENCED DOCUMENTS
  2.1 Government documents
       2.1.1 Specifications, standards and handbooks
  2.2 Other publications
3 DEFINITIONS
  3.1 Terms and definitions
4 GENERAL REQUIREMENTS
  4.1 Conflict
  4.2 Design
       4.2.1 Design requirements information
  4.3 Solder processes and processing
  4.4 Soldered connections
  4.5 Hybrid microelectronic modules and assemblies
  4.6 Electrostatic discharge
  4.7 Component positioning
  4.8 Visibility of markings
  4.9 Part marking and reference designations
  4.10 Interference spacing
  4.11 Part clearance spacing
  4.12 Piggybacking
  4.13 Lead forming
       4.13.1 Lead malforming limits
       4.13.2 Tempered leads
  4.14 Jumper wires
  4.15 Insulation clearance
  4.16 Eyelets
  4.17 Resins and other adhesives
5 DETAIL REQUIREMENTS
  5.1 Mounting of parts and components
       5.1.1 Parts and components mounted to printed wiring
              boards
       5.1.2 Terminal board mountings
       5.1.3 Mounting to terminals
6 NOTES
  6.1 Supersession note
  6.2 Changes from previous issue
  6.3 Subject term (key word listing)
  6.4 Use of metric units
INDEX
INDEX OF REFERENCED DOCUMENTS

Specifies mounting for electrical and electronic components and wiring in aircraft, guided missiles, satellites, ammunition and weapon systems, shipboard weapon systems, ground vehicle equipment, and program critical ground support equipment.

Committee
AREA SOLD
DevelopmentNote
A NOTICE 1 - Notice of Cancellation/Superseded by MIL STD 2000 (11/2003)
DocumentType
Standard
Pages
76
PublisherName
US Military Specs/Standards/Handbooks
Status
Superseded
SupersededBy

DOD-STD-2000-1 Revision B:1986 SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY
DOD STD 2000/3 : A NOTICE 1 CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING TECHNOLOGY
MIL-C-28809 Revision B:1988 CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX
MIL-STD-1547 Revision B:1992 ELECTRONIC PARTS, MATERIALS, AND PROCESSES FOR SPACE VEHICLES

DOD STD 2000/3 : A NOTICE 1 CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING TECHNOLOGY
MIL-STD-2118 Base Document:1984 FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
MIL C 55365/4 : D CAPACITORS, CHIP, FIXED, TANTALUM, ESTABLISHED RELIABILITY, STYLES CWR06 AND CWR09
MIL-STD-275 Revision E:1984 PRINTED WIRING - ELECTRONIC EQUIPMENT
DOD STD 1686 : 0 ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)(METRIC)
DOD-STD-2000-1 Revision B:1986 SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY
MIL-M-38510 Revision J:1991 MICROCIRCUITS, SPECIFICATION FOR
MS21266 Revision E:1981 GROMMET PLASTIC EDGING
DOD HDBK 263 : LATEST ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)METRIC
MIL-STD-1389 Revision D:1989 DESIGN REQUIREMENTS FOR STANDARD ELECTRONIC MODULES
MIL R 55342 : C RESISTORS, FIXED, FILM, CHIP, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
MIL P 50884 : E PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR

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