HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINIUM ALLOY

Publisher

1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES

Specifies the requirements for a family of aluminum alloy fin stock heat sinks for use with electronic components.

Committee	FSC 5999
DocumentType	Standard
PublisherName	Defense Supply Centre Columbus
Status	Current

MIL-H-87111 Revision A:1984	HEAT SINKS, SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
ANSI/NCSL Z540 1 : 94(R2002)	CALIBRATION - CALIBRATION LABORATORIES AND MEASURING AND TEST EQUIPMENT - GENERAL REQUIREMENTS
MIL-DTL-19491 Revision J:2014	SEMICONDUCTOR DEVICES, PACKAGING OF
ASTM B 209 : 2014 : REDLINE	Standard Specification for Aluminum and Aluminum-Alloy Sheet and Plate
MIL-STD-202 Revision H:2015	ELECTRONIC AND ELECTRICAL COMPONENT PARTS

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DSCC 85136 : E