EN 60068-2-54:2006
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
01-06-2017
07-08-2006
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the test
5 Description of the test apparatus
5.1 Test system
5.2 Solder bath
6 Preconditioning
6.1 Preparation of specimens
6.2 Ageing
7 Materials
7.1 Solder
7.2 Flux
8 Procedure
8.1 Test temperature
8.2 Fluxing
8.3 Flux drying
8.4 Test
9 Presentation of results
9.1 Form of chart-recorder trace
9.2 Points of significance
9.3 Reference wetting force
9.4 Test requirements
10 Information to be given in the relevant specification
Annex A (normative) Equipment specification
Annex B (informative) Guide to the use of the wetting balance
for solderability testing
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
| Committee |
CLC/SR 91
|
| DevelopmentNote |
Supersedes HD 323.2.54. (08/2006)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| UNE-EN 60068-2-54:2007 | Identical |
| IEC 60068-2-54:2006 | Identical |
| PN EN 60068-2-54 : 2009 | Identical |
| NEN EN IEC 60068-2-54 : 2006 | Identical |
| SN EN 60068-2-54 : 2006 | Identical |
| DIN EN 60068-2-54:2007-01 | Identical |
| CEI EN 60068-2-54 : 2007 | Identical |
| I.S. EN 60068-2-54:2006 | Identical |
| BS EN 60068-2-54:2006 | Identical |
| NF EN 60068 2-54 : 2015 | Identical |
| NBN EN 60068-2-54 : 2007 | Identical |
| BS EN 61188-5-5:2007 | Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides |
| BS EN 60539-1:2016 | Directly heated negative temperature coefficient thermistors Generic specification |
| BS EN 60384-4:2016 | Fixed capacitors for use in electronic equipment Sectional specification. Fixed aluminium electrolytic capacitors with solid (MnO<sub>2</sub>) and non-solid electrolyte |
| BS EN 60384-1:2016 | Fixed capacitors for use in electronic equipment Generic specification |
| BS EN 61051-1:2008 | Varistors for use in electronic equipment Generic specification |
| I.S. EN 61051-1:2008 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| OVE/ONORM EN 61051-1 : 2009 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 61076-4-116 : 2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS - DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION |
| I.S. EN 60539-1:2016 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
| EN 61051-1:2008 | Varistors for use in electronic equipment - Part 1: Generic specification |
| EN 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
| I.S. EN 60384-1:2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| CEI EN 60384-4 : 2007 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 4: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
| BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| BS EN 61169-1:2013 | Radio-frequency connectors Generic specification. General requirements and measuring methods |
| BS EN 60115-1 : 2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60115-1:2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| CEI EN 61051-1 : 2010 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 60068-2-20:2008 | Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads |
| I.S. EN 61076-4-116:2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS - DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION |
| EN 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
| I.S. EN 61169-1:2013 | RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS |
| I.S. EN 62391-1:2016 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| EN 61169-1:2013/AC:2016-02 | RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS (IEC 61169-1:2013) |
| EN 60539-1:2016/AC:2017-09 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017) |
| EN 61076-4-116:2012/A1:2016 | CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS - DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION (IEC 61076-4-116:2012/A1:2015) |
| EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| CEI EN 60539-1 : 2009 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60384-4:2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 4: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
| EN 60384-4:2016 | Fixed capacitors for use in electronic equipment - Part 4: Sectional specification - Fixed aluminium electrolytic capacitors with solid (MnO2) and non-solid electrolyte |
| EN 62391-1:2016/AC:2016-12 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015/COR1:2016) |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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