ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)

Amendment of

EN 60068-2-58:2015

Published date

13-04-2018

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Grouping of soldering processes and related
   test severities
5 Test equipment
6 Test Td[1]: Solderability of terminations
7 Test Td[2]: Resistance to soldering heat
8 Test Td[3]: Dewetting and resistance to dissolution of
   metallization
9 Final measurements
10 Information to be given in the relevant specification
Annex A (normative) - Criteria for visual inspection
Annex B (informative) - Guidance
Annex C (normative) - Application of the test methods to through
        hole reflow soldering components (THR)
Annex X (informative) - Cross reference for references to the
        prior revision of this specification
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Gives procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

Committee	SR 91
DevelopmentNote	Supersedes HD 323.2.58. (03/2004)
DocumentType	Test Method
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
UNE-EN 60068-2-58:2006	Identical
NEN EN IEC 60068-2-58 : 2015	Identical
CEI EN 60068-2-58 : 2016	Identical
VDE 0468-2-58 : 2016	Identical
DIN EN 60068-2-58 : 2018-09	Identical
I.S. EN 60068-2-58:2015	Identical
OVE/ONORM EN 60068-2-58 : 2016	Identical
IEC 60068-2-58:2015+AMD1:2017 CSV	Identical
CEI EN 60068-2-58 : 2016/A1:2018	Identical
NBN EN 60068 2-58 : 2015	Identical
PN EN 60068-2-58 : 2015	Identical
NF EN 60068-2-58 : 2015	Identical
VDE 0468-2-58:2018-09	Identical
DIN EN 60068-2-58 : 2016	Identical
SN EN 60068-2-58 : 1999	Identical
BS EN 60068-2-58 : 2015	Identical
BS EN 60068-2-58:2015+A1:2018	Identical

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
ISO 9454-2:1998	Soft soldering fluxes Classification and requirements Part 2: Performance requirements
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 61760-4:2015	Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
IEC TR 60068-3-12:2014	Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
EN 61249-2-35:2009	Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
EN ISO 9454-2:2000	Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
EN 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61760-3:2010	Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
EN 61249-2-22:2005	Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
IEC 60068-2-54:2006	Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
IEC 60068-3-13:2016	Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 61249-2-35:2008	Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61249-2-22:2005	Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 075 : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
EN 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 60068-2-69:2017	Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications