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CENELEC
EN 60249-2-1 : 1994 AMD 4 2000

EN 60249-2-1 : 1994 AMD 4 2000

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET - HIGH ELECTRICAL QUALITY

Withdrawn date

01-02-2006

Published date

12-01-2013

Publisher

European Committee for Standards - Electrical

FOREWORD
PREFACE
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material after
  complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other international publications
         quoted in this standard with the references of
         the relevant European publications

Provides requirements for properties of phenolic cellulose paper copper-clad laminated sheet, high electrical quality, in thicknesses of 0.5 mm up to 6.4 mm.

Committee
SR 91
DevelopmentNote
Supersedes HD 313.2.1 (05/2001)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Withdrawn

BS EN 60297-3-101:2004 Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series Subracks and associated plug-in units
EN 60297-3-101:2004 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units
I.S. EN 60297-3-101:2004 MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT - DIMENSIONS OF MECHANICAL STRUCTURES OF THE 482,6 MM (19 IN) SERIES - PART 3-101: SUBRACKS AND ASSOCIATED PLUG-IN UNITS
CEI EN 60297-3-101 : 2005 MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT - DIMENSIONS OF MECHANICAL STRUCTURES OF THE 482,6 MM (19 IN) SERIES - PART 3-101: SUBRACKS AND ASSOCIATED PLUG-IN UNITS

IEC 60249-3-3:1991 Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
IEC 60249-3-1:1981 Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS

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