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EN 61188-5-1:2002

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Superseded date

12-04-2021

Published date

22-10-2002

FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Design requirements
   4.1 General
        4.1.1 Classification
        4.1.2 Land pattern determination
   4.2 Dimensioning systems
        4.2.1 Component tolerancing
        4.2.2 Land tolerancing
        4.2.3 Fabrication allowances
        4.2.4 Assembly tolerancing
        4.2.5 Dimension and tolerance analysis
   4.3 Design producibility
        4.3.1 SMT land pattern
        4.3.2 Standard component selection
        4.3.3 Circuit substrate development
        4.3.4 Assembly considerations
        4.3.5 Provision for automated test
        4.3.6 Documentation for SMT
   4.4 Environmental constraint
        4.4.1 Moisture sensitive components
        4.4.2 End-use environment considerations
   4.5 Design rules
        4.5.1 Component spacing
        4.5.2 Single- and double-sided board assembly
        4.5.3 Solder paste stencil
        4.5.4 Component stand-off height for cleaning
        4.5.5 Fiducial marks
        4.5.6 Conductors
        4.5.7 Via guidelines
        4.5.8 Standard fabrication allowances
        4.5.9 Panelization
   4.6 Outer layer finishes
        4.6.1 Solder-mask finishes
        4.6.2 Solder-mask clearances
        4.6.3 Land-pattern finishes
5 Quality and reliability validation
   5.1 Validation techniques
6 Testability
   6.1 Five types of testing
        6.1.1 Bare-board test
        6.1.2 Assembled board test
   6.2 Nodal access
        6.2.1 Test philosophy
        6.2.2 Test strategy for bare boards
   6.3 Full nodal access for assembled board
        6.3.1 In-circuit test accommodation
        6.3.2 Multi-probe testing
   6.4 Limited nodal access
   6.5 No nodal access
   6.6 Clam-shell fixtures impact
   6.7 Printed board test characteristics
        6.7.1 Test land pattern spacing
        6.7.2 Test land size and shape
        6.7.3 Design for test parameters
7 Printed board structure types
   7.1 General considerations
        7.1.1 Categories
        7.1.2 Thermal expansion mismatch
   7.2 Organic base material
   7.3 Non-organic base materials
   7.4 Alternative PB structures
        7.4.1 Supporting-plane PB structures
        7.4.2 High-density PB technology
        7.4.3 Discrete-wire interconnect
        7.4.4 Constraining core structures
        7.4.5 Porcelainized metal (metal core) structures
8 Assembly considerations for surface-mount technology (SMT)
   8.1 SMT assembly process sequence
   8.2 Substrate preparation
        8.2.1 Adhesive application
        8.2.2 Conductive adhesive
        8.2.3 Solder paste application
        8.2.4 Solder preforms
   8.3 Component placement
        8.3.1 Component data transfer
   8.4 Soldering processes
        8.4.1 Wave soldering
        8.4.2 Vapour-phase soldering
        8.4.3 IR reflow
        8.4.4 Hot air/gas convection
        8.4.5 Laser reflow soldering
   8.5 Cleaning
   8.6 Repair/rework
        8.6.1 Re-use of removed components
        8.6.2 Heatsink effects
        8.6.3 Dependence on printed board material type
        8.6.4 Dependence on copper land and conductor layout
        8.6.5 Selection of suitable rework equipment
        8.6.6 Dependence on assembly structure and soldering
              processes
Annex A (informative) Test patterns - Process evaluations
Annex B (informative) Abbreviations
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Committee
CLC/SR 91
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Superseded
SupersededBy

BS EN 61188-5-5:2007 Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
I.S. EN 61188-5-2:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
EN 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
EN 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
EN 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
I.S. EN 61188-5-5:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
I.S. EN 60352-5:2012-2015-10 SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012 (EQV))
BS EN 60352-5:2012 Solderless connections Press-in connections. General requirements, test methods and practical guidance
CEI EN 60352-5 : 2013 SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
BS EN 61188-5-4:2007 Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
I.S. EN 61188-5-3:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
BS EN 61188-5-8:2008 Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
I.S. EN 61188-5-6:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
I.S. EN 61188-5-8:2008 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
EN 60352-5:2012/AC:2014 SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012)
BS EN 61188-5-6:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
BS EN 61188-5-3:2007 Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
BS EN 61188-5-2:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
EN 61188-5-8:2008 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
EN 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
EN 61188-5-4 : 2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES

EN 60097:1993 Grid systems for printed circuits
IEC 61188-1-1:1997 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 60097:1991 Grid systems for printed circuits
EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
EN 61188-1-1:1997 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

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